Ihe ngwọta EMS maka bọọdụ sekit e biri ebi
Nkọwa
Ejiri ngwaọrụ SPI, AOI na X-ray maka ahịrị 20 SMT, 8 DIP, na ahịrị ule, anyị na-enye ọrụ dị elu nke na-agụnye usoro mgbakọ dị iche iche ma mepụta PCBA multi-layers, PCBA na-agbanwe agbanwe.Laboratory ọkachamara anyị nwere ROHS, dobe, ESD na ngwaọrụ nnwale dị elu & dị ala.A na-ebufe ngwaahịa niile site na njikwa mma.Iji usoro MES dị elu maka njikwa nrụpụta n'okpuru ọkọlọtọ IAF 16949, anyị na-ejikwa mmepụta ahụ nke ọma na nke ọma.
Site na ijikọta ihe onwunwe na ndị injinia, anyị nwekwara ike ịnye ihe ngwọta nke mmemme, site na mmepe mmemme IC na ngwanrọ na nhazi sekit eletrik.Site na ahụmịhe n'ịzụlite ọrụ na ahụike na ngwa elektrọn ndị ahịa, anyị nwere ike weghara echiche gị wee weta ngwaahịa ahụ n'ezie.Site n'ịmepụta ngwanrọ, mmemme, na bọọdụ n'onwe ya, anyị nwere ike ijikwa usoro nrụpụta dum maka bọọdụ, yana ngwaahịa ikpeazụ.N'ihi ụlọ ọrụ PCB anyị na ndị injinia, ọ na-enye anyị uru asọmpi ma e jiri ya tụnyere ụlọ ọrụ nkịtị.Dabere n'ichepụta ngwaahịa & otu mmepe, usoro nrụpụta nke guzosiri ike nke nha dị iche iche, yana nkwurịta okwu dị irè n'etiti eriri ọkọnọ, anyị nwere obi ike na anyị ga-eche ihe ịma aka ihu ma nweta ọrụ ahụ.
PCBA ike | |
Ngwa akpaaka | Nkọwa |
Igwe nrịbama laser PCB500 | Oke akara: 400*400mm |
Ọsọ ọsọ: ≤7000mm/S | |
Ike kachasị: 120W | |
Q-ịgbanwe, Oke ọrụ: 0-25KHZ;0-60% | |
Igwe obibi akwụkwọ DSP-1008 | Nha PCB: MAX:400*34mm MIN:50*50mm T:0.2~6.0mm |
Nha Stensụl: MAX:737*737mm MIN: 420*520mm | |
Scraper mgbali: 0.5 ~ 10Kgf/cm2 | |
Usoro nhicha: ihicha akọrọ, ihicha mmiri, ihicha agụụ (nke a na-eme mmemme) | |
Ọsọ mbipụta: 6 ~ 200mm / sk | |
Izi ezi mbipụta: ± 0.025mm | |
SPI | Ụkpụrụ nha: 3D White Light PSLM PMP |
Ihe nlere: olu mado ihe nchara, mpaghara, ịdị elu, mbelata XY, udi | |
Mkpebi oghere: 18um | |
Nkenkenke: Mkpebi XY: 1um; Ọsọ dị elu: 0.37um | |
Nlele akụkụ: 40*40mm | |
Ọsọ FOV: 0.45s/FOV | |
Igwe SMT dị elu SM471 | Nha PCB: MAX:460*250mm MIN:50*40mm T:0.38~4.2mm |
Ọnụọgụ nke osisi mgbago: 10 spindles x 2 cantilevers | |
Nha akụkụ: Chip 0402 (01005 inch) ~ □14mm(H12mm) IC, Njikọ (pitịpụ ụzọ 0.4mm), ※BGA,CSP(Tin ball spacing 0.4mm) | |
Ịkwado ziri ezi: mgbawa ± 50um@3ó/chip, QFP ± 30um@3ó/chip | |
Ọsọ mgbanye: 75000 CPH | |
Igwe SMT dị elu SM482 | Nha PCB: MAX:460*400mm MIN:50*40mm T:0.38~4.2mm |
Ọnụọgụ nke osisi na-arị elu: 10 spindles x 1 cantilever | |
Akụkụ akụkụ: 0402 (01005 inch) ~ □ 16mm IC, Njikọ (ndụ ụzọ 0.4mm), ※ BGA, CSP (Tin ball spacing 0.4mm) | |
Ịkwado ziri ezi: ± 50μm@μ+3σ (dị ka nha mgbawa ọkọlọtọ si dị) | |
Ọsọ mgbanye: 28000 CPH | |
HELLER MARK III Nitrogen reflux oven | Mpaghara: Mpaghara kpo oku 9, mpaghara jụrụ oyi 2 |
Isi iyi ọkụ: ikuku ikuku na-ekpo ọkụ | |
Okpomọkụ akara nkenke: ± 1 ℃ | |
Ike nkwụghachi ọkụ: ± 2 ℃ | |
Ọsọ okirikiri: 180-1800mm/min | |
Ogologo obosara nke egwu: 50-460mm | |
AOI ALD-7727D | Ụkpụrụ nha: Igwefoto HD na-enweta ọnọdụ ntụgharị nke akụkụ ọ bụla nke ìhè agba atọ na-enwu na bọọdụ PCB, ma na-ekpe ya ikpe site n'itinye onyonyo ma ọ bụ ọrụ ezi uche dị na ya nke isi awọ na ụkpụrụ RGB nke isi pixel ọ bụla. |
Ihe nlere: Ihe nrịbama nke nbipụta ihe nrụnye, ntụpọ akụkụ, ntụpọ nkwonkwo solder | |
Mkpebi oghere: 10um | |
Nkenkenke: Mkpebi XY: ≤8um | |
3D X-RAY AX8200MAX | Ogo nchọpụta kachasị: 235mm*385mm |
Ike kachasị: 8W | |
Oke voltaji: 90KV/100KV | |
Nha lekwasịrị anya: 5μm | |
Nchekwa (ọnụọgụ radieshon): 1uSv/h | |
Ịzụ ahịa Wave DS-250 | PCB obosara: 50-250mm |
PCB nnyefe elu: 750 ± 20 mm | |
Ọsọ nnyefe: 0-2000mm | |
Ogologo mpaghara preheating: 0.8M | |
Ọnụọgụ mpaghara ikpo ọkụ: 2 | |
Nọmba ebili mmiri: Ifu mmiri abụọ | |
Igwe ihe nkesa bọọdụ | Oke ọrụ: MAX:285*340mm MIN:50*50mm |
Ịcha nkenke: ± 0.10mm | |
Ọsọ ịkpụ: 0 ~ 100mm/S | |
Ọsọ ntụgharị nke spindle: MAX:40000rpm |
Ike teknụzụ | ||
Nọmba | Ihe | Nnukwu ike |
1 | isi ihe | Nkịtị Tg FR4, High Tg FR4, PTFE, Rogers, Low Dk / Df wdg. |
2 | Agba nkpuchi solder | akwụkwọ ndụ akwụkwọ ndụ, ọbara ọbara, acha anụnụ anụnụ, ọcha, odo, odo odo, nwa |
3 | Agba akụkọ mgbe ochie | ọcha, odo, oji, uhie |
4 | Ụdị ọgwụgwọ elu | ENIG, Immersion tin, HAF, HAF LF, OSP, gold flash, gold finger, sterling silver |
5 | Oke.oyi akwa(L) | 50 |
6 | Oke.nha otu (mm) | 620*813 (24"*32") |
7 | Oke.Nha panel arụ ọrụ (mm) | 620*900 (24"x35.4") |
8 | Oke.ọkpụrụkpụ osisi (mm) | 12 |
9 | Min.ọkpụrụkpụ osisi (mm) | 0.3 |
10 | Nkwado ọkpụrụkpụ osisi (mm) | T <1.0 mm: +/-0.10mm;T≥1.00mm: +/-10% |
11 | Nkwenye ndebanye aha (mm) | +/- 0.10 |
12 | Min.dayameta oghere nke igwe igwe (mm) | 0.15 |
13 | Min.dayameta oghere laser (mm) | 0,075 |
14 | Oke.akụkụ (site na oghere) | 15:1 |
Oke.akụkụ (micro-via) | 1.3:1 | |
15 | Min.onu onu ruo oghere ọla kọpa (mm) | L≤10, 0.15;L=12-22,0.175;L=24-34, 0.2;L=36-44, 0.25;L>44, 0.3 |
16 | Min.mkpochapụ ime ime (mm) | 0.15 |
17 | Min.Oghere oghere ruo n'ọnụ oghere (mm) | 0.28 |
18 | Min.onu onu ka oghere ahịrị profaịlụ (mm) | 0.2 |
19 | Min.ọla kọpa dị n'ime na sapce ahịrị profaịlụ (mm) | 0.2 |
20 | Nkwenye ndebanye aha n'etiti oghere (mm) | ±0.05 |
21 | Oke.ọkpụrụkpụ ọla kọpa emechara (um) | Mpụta oyi akwa: 420 (12oz) oyi akwa n'ime: 210 (6oz) |
22 | Min.obosara trace (mm) | 0.075 (3 nde) |
23 | Min.oghere traktọ (mm) | 0.075 (3 nde) |
24 | Ọkpụrụkpụ nkpuchi solder (um) | nkuku ahịrị:> 8 (0.3mil) n'elu ọla kọpa:> 10 (0.4mil) |
25 | Ọkpụrụkpụ ọla edo ENIG (um) | 0.025-0.125 |
26 | ENIG nickle ọkpụrụkpụ (um) | 3-9 |
27 | Ọlaọcha Sterling (um) | 0.15-0.75 |
28 | Min.Hal tin ọkpụrụkpụ (um) | 0.75 |
29 | Ọkpụrụkpụ tin imikpu (um) | 0.8-1.2 |
30 | Ọkpụrụkpụ ọla edo siri ike (um) | 1.27-2.0 |
31 | mkpịsị aka ọla edo na-etinye ọkpụrụkpụ ọla edo (um) | 0.025-1.51 |
32 | Mkpịsị aka ọla edo edo edo nickle ọkpụrụkpụ(um) | 3-15 |
33 | Ọkpụrụkpụ ọla edo na-egbuke egbuke (um) | 0,025-0.05 |
34 | flash gold plating nickle ọkpụrụkpụ (um) | 3-15 |
35 | nnabata nha profaịlụ (mm) | ±0.08 |
36 | Oke.Ihe nkpuchi nkwụnye ego nha (mm) | 0.7 |
37 | BGA pad (mm) | ≥0.25 (HAL ma ọ bụ HAL efu: 0.35) |
38 | Nkwekọrịta ọnọdụ agụba V-CUT (mm) | +/- 0.10 |
39 | Nkwenye ọnọdụ V-CUT (mm) | +/- 0.10 |
40 | Nkwenye n'akụkụ mkpịsị aka ọla edo (o) | +/-5 |
41 | Nkwenye mgbochi (%) | +/-5% |
42 | Nkwenye ibe akwụkwọ (%) | 0.75% |
43 | Min.obosara akụkọ (mm) | 0.1 |
44 | Ọkụ na-enwu | 94V-0 |
Pụrụ iche maka Via na ngwaahịa pad | Ogo oghere resin (min.) (mm) | 0.3 |
Ogo oghere resin (kacha) (mm) | 0.75 | |
Ọkpụrụkpụ mbadamba resin (min.) (mm) | 0.5 | |
Ọkpụrụkpụ mbadamba resin (max.) (mm) | 3.5 | |
Oke akụkụ resin etinyere | 8:1 | |
Oghere kacha nta nke resin ruo oghere oghere (mm) | 0.4 | |
Enwere ike ịdị iche nha nha n'otu bọọdụ? | ee | |
bọọdụ ụgbọ elu azụ | Ihe | |
Oke.nha pnl (emechara) (mm) | 580*880 | |
Oke.Nha panel arụ ọrụ (mm) | 914 × 620 | |
Oke.ọkpụrụkpụ osisi (mm) | 12 | |
Oke.oyi akwa(L) | 60 | |
Akụkụ | 30:1 (Oghere nkeji: 0.4 mm) | |
Ogologo ahịrị obosara / oghere (mm) | 0.075 / 0.075 | |
Ikike ịkụ azụ azụ | Ee | |
Nkwenye nke akuku azụ (mm) | ±0.05 | |
Nkwenye nke oghere ndị dabara adaba (mm) | ±0.05 | |
Ụdị ọgwụgwọ elu | OSP, ọla ọcha sterling, ENIG | |
bọọdụ siri ike-flex | Nha oghere (mm) | 0.2 |
Ọkpụrụkpụ ọkụ eletrik (mm) | 0.025 | |
Nha Panel na-arụ ọrụ (mm) | 350 x 500 | |
Ogologo ahịrị obosara / oghere (mm) | 0.075 / 0.075 | |
Ihe siri ike | Ee | |
Mpempe bọọdụ Flex (L) | 8 (4plys nke bọọdụ flex) | |
Mpempe bọọdụ siri ike (L) | ≥14 | |
Ọgwụgwọ elu | Ha niile | |
Flex bọọdụ dị n'etiti ma ọ bụ elu oyi akwa | Ha abụọ | |
Pụrụ iche maka ngwaahịa HDI | Nha oghere oghere nke laser (mm) | 0,075 |
Oke.ọkpụrụkpụ dielectric (mm) | 0.15 | |
Min.ọkpụrụkpụ dielectric (mm) | 0.05 | |
Oke.akụkụ | 1.5:1 | |
Nha mpe mpe akwa (n'okpuru micro-via) (mm) | Oghere oghere + 0.15 | |
Nha mpe mpe akwa n'elu (na micro-via) (mm) | Oghere oghere + 0.15 | |
Ndochi ọla kọpa ma ọ bụ na ọ bụghị (ee ma ọ bụ mba) (mm) | ee | |
Site na imewe Pad ma ọ bụ na ọ bụghị (ee ma ọ bụ mba) | ee | |
Akpanyere resin oghere e liri (ee ma ọ bụ mba) | ee | |
Min.site na nha nwere ike jupụta ọla kọpa (mm) | 0.1 | |
Oke.oge nchịkọta | oyi akwa ọ bụla |