EMS mhinduro dzePrinted Circuit Board
Tsanangudzo
Takashongedzerwa neSPI, AOI, uye X-ray mudziyo wemitsara makumi maviri yeSMT, 8 DIP, uye mitsara yekuyedza, tinopa sevhisi yemhando yepamusoro inosanganisira nzira dzakasiyana siyana dzemagungano uye kugadzira akawanda-layers PCBA, inochinjika PCBA.Yedu nyanzvi marabhoritari ine ROHS, kudonha, ESD, uye yakakwira & yakaderera tembiricha yekuyedza michina.Zvese zvigadzirwa zvinounzwa nekuomesera kwemhando yekudzora.Tichishandisa iyo yepamusoro MES sisitimu yekugadzira manejimendi pasi peIAF 16949 yakajairwa, isu tinobata kugadzirwa zvakanaka uye zvakachengeteka.
Nekubatanidza zviwanikwa uye mainjiniya, tinogona zvakare kupa mhinduro dzechirongwa, kubva kuIC chirongwa chekuvandudza uye software kusvika kumagetsi edunhu dhizaini.Tine ruzivo mukugadzira mapurojekiti mune zvehutano uye zvemagetsi zvevatengi, tinogona kutora mazano ako uye kuunza chigadzirwa chaicho kuhupenyu.Nekugadzira software, chirongwa, uye bhodhi pachayo, isu tinokwanisa kubata iyo yose yekugadzira maitiro ebhodhi, pamwe chete nezvigadzirwa zvekupedzisira.Kutenda kune yedu PCB fekitori uye mainjiniya, inotipa mabhenefiti ekukwikwidza kana achienzaniswa neyakajairwa fekitori.Zvichienderana nedhizaini yekugadzira & timu yekusimudzira, iyo yakagadzwa yekugadzira nzira yehuwandu hwakasiyana, uye kutaurirana kunoshanda pakati peiyo ketani yekugovera, isu tine chivimbo chekutarisana nematambudziko uye kuita kuti basa riitwe.
| PCBA Kugona | |
| Automatic equipment | Tsanangudzo |
| Laser yekumaka muchina PCB500 | Kuisa chiratidzo: 400 * 400mm |
| Kumhanya: ≤7000mm/S | |
| Maximum simba: 120W | |
| Q-kuchinja, Duty Ratio: 0-25KHZ;0-60% | |
| Kuprinda muchina DSP-1008 | PCB saizi: MAX:400*34mm MIN:50*50mm T:0.2~6.0mm |
| Stencil size: MAX: 737 * 737mm MIN:420*520mm | |
| Scraper pressure: 0.5 ~ 10Kgf/cm2 | |
| Nzira yekuchenesa: Dry kuchenesa, kuchenesa mvura, vacuum kuchenesa (inorongwa) | |
| Kudhinda kumhanya: 6 ~ 200mm/sec | |
| Kudhinda nemazvo: ± 0.025mm | |
| SPI | Kuyeresa musimboti: 3D White Chiedza PSLM PMP |
| Chiyero chinhu: Solder paste vhoriyamu, nzvimbo, kureba, XY offset, chimiro | |
| Lens kugadzirisa: 18um | |
| Kururamisa: XY kugadziriswa: 1um; High kumhanya: 0.37um | |
| Kutarisa chiyero: 40 * 40mm | |
| FOV kumhanya: 0.45s/FOV | |
| High kumhanya SMT muchina SM471 | PCB saizi: MAX:460*250mm MIN:50*40mm T:0.38~4.2mm |
| Nhamba yekusimudza shafts: 10 spindles x 2 cantilevers | |
| Saizi yechikamu: Chip 0402(01005 inch) ~ □14mm(H12mm) IC,Chibatanidza(lead pitch 0.4mm),※BGA,CSP(Tin ball spacing 0.4mm) | |
| Kukwira chaiko: chip ±50um@3ó/chip, QFP ±30um@3ó/chip | |
| Kumhanyisa kumhanya: 75000 CPH | |
| High kumhanya SMT muchina SM482 | PCB saizi: MAX:460*400mm MIN:50*40mm T:0.38~4.2mm |
| Nhamba yekusimudza shafts: 10 spindles x 1 cantilever | |
| Saizi yechikamu: 0402(01005 inch) ~ □16mm IC,Chibatanidza(lead pitch 0.4mm),※BGA,CSP(Tin ball spacing 0.4mm) | |
| Kukwira chaiko: ± 50μm@μ+3σ (maererano nehukuru hwechip) | |
| Kumhanyisa kumhanya: 28000 CPH | |
| HELLER MARK III Nitrogen reflux choto | Zone: 9 yekudziya nzvimbo, 2 yekutonhora nzvimbo |
| Heat source: Heat convection | |
| Kunyatso kudzora tembiricha: ± 1℃ | |
| Thermal muripo wesimba: ± 2 ℃ | |
| Orbital kumhanya: 180-1800mm / min | |
| Track hupamhi: 50-460mm | |
| AOI ALD-7727D | Kuyeresa musimboti: Iyo HD kamera inowana ratidziro yechikamu chega chega chetatu-ruvara mwenje inovhenekera paPCB board, uye inoitonga nekufananidza mufananidzo kana zvine musoro kushanda kwegrey uye RGB kukosha kweimwe neimwe pixel point. |
| Chiyero chinhu: Solder paste kudhinda kukanganiswa, zvikamu zvakakanganisika, solder majoini akaremara | |
| Lens kugadzirisa: 10um | |
| Kururamisa: XY resolution: ≤8um | |
| 3D X-RAY AX8200MAX | Saizi yepamusoro yekuona: 235mm * 385mm |
| Maximum simba: 8W | |
| Maximum voltage: 90KV/100KV | |
| Saizi yekutarisa: 5μm | |
| Kuchengeteka (mwaranzi dose): ＜1uSv/h | |
| Wave soldering DS-250 | PCB upamhi: 50-250mm |
| PCB kutapurirana kureba: 750 ± 20 mm | |
| Kufambisa kumhanya: 0-2000mm | |
| Hurefu hwe preheating zone: 0.8M | |
| Nhamba ye preheating zone: 2 | |
| Wave nhamba: Dual wave | |
| Board splitter muchina | Basa rekushanda: MAX: 285 * 340mm MIN: 50 * 50mm |
| Kucheka chaiko: ± 0.10mm | |
| Kucheka kumhanya: 0 ~ 100mm/S | |
| Kumhanya kwekutenderera kwe spindle: MAX: 40000rpm | |
| Technology Kugona | ||
| Number | Item | Kugona kukuru |
| 1 | base material | Normal Tg FR4, High Tg FR4, PTFE, Rogers, Low Dk/Df nezvimwe. |
| 2 | Solder mask ruvara | green, red, blue, white, yellow, purple, black |
| 3 | Legend color | chena, yero, nhema, tsvuku |
| 4 | Pamusoro pekurapa mhando | ENIG, Immersion tin, HAF, HAF LF, OSP, goridhe rinopenya, chigunwe chegoridhe, sirivha inopenya |
| 5 | Max.layer-up(L) | 50 |
| 6 | Max.saizi yeyuniti (mm) | 620*813 (24"*32") |
| 7 | Max.saizi yepaneru yekushanda (mm) | 620*900 (24"x35.4") |
| 8 | Max.bhodhi ukobvu (mm) | 12 |
| 9 | Min.bhodhi ukobvu(mm) | 0.3 |
| 10 | Bhodhi ukobvu kushivirira (mm) | T<1.0 mm: +/-0.10mm ;T≥1.00mm: +/-10% |
| 11 | Kunyoresa kushivirira (mm) | +/-0.10 |
| 12 | Min.Mechini yekuchera gomba dhayamita (mm) | 0.15 |
| 13 | Min.Laser kuchera gomba dhayamita(mm) | 0.075 |
| 14 | Max.chikamu (kuburikidza neburi) | 15:1 |
| Max.chikamu (micro-via) | 1.3:1 | |
| 15 | Min.gomba kumucheto kune nzvimbo yemhangura (mm) | L≤10, 0.15;L=12-22,0.175;L=24-34, 0.2;L=36-44, 0.25;L＞44, 0.3; |
| 16 | Min.Innerlay clearance(mm) | 0.15 |
| 17 | Min.gomba kumucheto kune gomba kumucheto nzvimbo (mm) | 0.28 |
| 18 | Min.gomba kumucheto kune profile line nzvimbo (mm) | 0.2 |
| 19 | Min.Innerlay mhangura kune profile line sapce (mm) | 0.2 |
| 20 | Kunyoresa kushivirira pakati pemakomba (mm) | ±0.05 |
| 21 | Max.kupera kwemhangura ukobvu (um) | Musara Wekunze: 420 (12oz) Mukati memukati: 210 (6oz) |
| 22 | Min.trace wide (mm) | 0.075 (3mil) |
| 23 | Min.nzvimbo yekutsvaga (mm) | 0.075 (3mil) |
| 24 | Solder mask ukobvu (um) | mutsara kona: > 8 (0.3mil) pamhangura: >10 (0.4mil) |
| 25 | ENIG goridhe ukobvu (um) | 0.025-0.125 |
| 26 | ENIG nickle ukobvu (um) | 3-9 |
| 27 | Sterling sirivheri ukobvu (um) | 0.15-0.75 |
| 28 | Min.HAL tini ukobvu (um) | 0.75 |
| 29 | Kunyudza tin ukobvu (um) | 0.8-1.2 |
| 30 | Goridhe yakaoma-gobvu inoisa goridhe ukobvu (um) | 1.27-2.0 |
| 31 | chigunwe chegoridhe chinoisa ukobvu hwegoridhe (um) | 0.025-1.51 |
| 32 | chigunwe chegoridhe chinoisa nickle ukobvu(um) | 3-15 |
| 33 | goridhe rinopenya goridhe ukobvu (um) | 0,025-0.05 |
| 34 | flash goridhe plating nickle ukobvu (um) | 3-15 |
| 35 | Profile saizi kushivirira (mm) | ±0.08 |
| 36 | Max.solder mask plugging gomba size (mm) | 0.7 |
| 37 | BGA padhi (mm) | ≥0.25 (HAL kana HAL Yemahara:0.35) |
| 38 | V-CUT blade chinzvimbo kushivirira (mm) | +/-0.10 |
| 39 | V-CUT kushivirira chinzvimbo (mm) | +/-0.10 |
| 40 | Gold finger bevel angle tolerance (o) | +/-5 |
| 41 | Impedence kushivirira (%) | +/-5% |
| 42 | Warpage kushivirira (%) | 0.75% |
| 43 | Min.upamhi hwengano (mm) | 0.1 |
| 44 | Moto unopisa | 94V-0 |
| Yakakosha yeVia mune zvigadzirwa zvepadhi | Resin yakavharwa gomba saizi (min.) (mm) | 0.3 |
| Resin yakavharwa gomba size (max.) (mm) | 0.75 | |
| Resin plugged board ukobvu (min.) (mm) | 0.5 | |
| Resin plugged board ukobvu (max.) (mm) | 3.5 | |
| Resin plugged maximum aspect ratio | 8:1 | |
| Resin yakabairwa buri shoma paburi renzvimbo (mm) | 0.4 | |
| Unogona here kusiyanisa saizi yegomba mubhodhi rimwe? | Ehe | |
| Back plane board | Item | |
| Max.pnl size (yapera) (mm) | 580*880 | |
| Max.saizi yepaneru yekushanda (mm) | 914 × 620 | |
| Max.bhodhi ukobvu (mm) | 12 | |
| Max.layer-up(L) | 60 | |
| Aspect | 30:1 (Min. gomba: 0.4 mm) | |
| Mutsetse wakafara/nzvimbo (mm) | 0.075/ 0.075 | |
| Back drill kugona | Ehe | |
| Kushivirira kwekuchera kumashure (mm) | ±0.05 | |
| Kushivirira kwemaburi anokodzera maburi (mm) | ±0.05 | |
| Pamusoro pekurapa mhando | OSP, sirivheri yakanaka, ENIG | |
| Rigid-flex board | Hukuru hwegomba (mm) | 0.2 |
| Dielectrical ukobvu (mm) | 0.025 | |
| Saizi yePaneru yekushanda (mm) | 350 x 500 | |
| Mutsetse wakafara/nzvimbo (mm) | 0.075/ 0.075 | |
| Stiffener | Ehe | |
| Flex board layers (L) | 8 (4plys of flex board) | |
| Rigid board layers (L) | ≥14 | |
| Kurapa kwepamusoro | Zvose | |
| Flex board iri pakati kana yekunze layer | Zvose | |
| Yakakosha kune HDI zvigadzirwa | Laser kuchera gomba saizi (mm) | 0.075 |
| Max.Dielectric ukobvu (mm) | 0.15 | |
| Min.Dielectric ukobvu (mm) | 0.05 | |
| Max.chimiro | 1.5:1 | |
| Padhi Padhi saizi (pasi pemicro-via) (mm) | Gomba saizi+0.15 | |
| Pamusoro Pedhi saizi (pamicro-via) (mm) | Gomba saizi+0.15 | |
| Mhangura yekuzadza kana kwete (hongu kana kwete) (mm) | Ehe | |
| Via muPad dhizaini kana kwete (hongu kana kwete) | Ehe | |
| Yakavigwa gomba resin yakavharwa (hongu kana kwete) | Ehe | |
| Min.kuburikidza nehukuru inogona kuzadzwa nemhangura (mm) | 0.1 | |
| Max.stack nguva | chero layer | |