EMS tharollo bakeng sa Printed Circuit Board
Tlhaloso
Re na le lisebelisoa tsa SPI, AOI, le X-ray bakeng sa mela e 20 ea SMT, 8 DIP, le mela ea teko, re fana ka tšebeletso e tsoetseng pele e kenyelletsang mekhoa e mengata ea ho kopanya le ho hlahisa PCBA ea mekhahlelo e mengata, PCBA e tenyetsehang.Laeborari ea rona ea litsebi e na le ROHS, drop, ESD, le lisebelisoa tse phahameng le tse tlase tsa tlhahlobo ea mocheso.Lihlahisoa tsohle li fetisoa ka taolo e tiileng ea boleng.Re sebelisa sistimi e tsoetseng pele ea MES bakeng sa taolo ea tlhahiso tlasa maemo a IAF 16949, re sebetsana le tlhahiso ka nepo le ka polokeho.
Ka ho kopanya lisebelisoa le baenjiniere, re ka boela ra fana ka tharollo ea lenaneo, ho tloha ho nts'etsopele ea lenaneo la IC le software ho ea ho moralo oa potoloho ea motlakase.Ka boiphihlelo ba ho nts'etsapele merero ea tlhokomelo ea bophelo bo botle le lisebelisoa tsa elektroniki tsa bareki, re ka nka maikutlo a hau mme ra tlisa sehlahisoa sa nnete bophelong.Ka ho hlahisa software, lenaneo, le boto ka boeona, re ka laola ts'ebetso eohle ea tlhahiso ea boto, hammoho le lihlahisoa tsa ho qetela.Ka lebaka la feme ea rona ea PCB le baenjiniere, e re fa melemo ea tlholisano ha e bapisoa le feme e tloaelehileng.Ho ipapisitsoe le moralo oa sehlahisoa le sehlopha sa nts'etsopele, mokhoa o hlophisitsoeng oa tlhahiso ea bongata bo fapaneng, le puisano e sebetsang lipakeng tsa ketane ea phepelo, re na le ts'epo ea ho tobana le mathata le ho etsa hore mosebetsi o etsoe.
| Bokhoni ba PCBA | |
| Thepa e ikemetseng | Tlhaloso |
| Mochini oa ho tšoaea oa laser PCB500 | Lethathamo la matšoao: 400 * 400mm |
| Lebelo: ≤7000mm/S | |
| Matla a phahameng: 120W | |
| Q-switching, Karo-karolelano ea mosebetsi: 0-25KHZ;0-60% | |
| Mochine oa khatiso oa DSP-1008 | PCB boholo: MAX:400*34mm MIN:50*50mm T:0.2~6.0mm |
| Boholo ba Stencil: MAX: 737 * 737mm MIN:420*520mm | |
| Khatello ea scraper: 0.5 ~ 10Kgf / cm2 | |
| Mokhoa oa ho hloekisa: Ho hloekisa ka mokhoa o omileng, ho hloekisa ka metsi, ho hloekisa li-vacuum (ho ka khoneha) | |
| Lebelo la ho hatisa: 6 ~ 200mm / sec | |
| Ho nepahala ha khatiso: ± 0.025mm | |
| SPI | Molao-motheo oa ho lekanya: 3D White Light PSLM PMP |
| Ntho ea tekanyo: bophahamo ba molumo oa solder, sebaka, bophahamo, XY offset, sebopeho | |
| Qeto ea lense: 18um | |
| Ho nepahala: Qeto ea XY: 1um; Lebelo le phahameng: 0.37um | |
| Boima ba pono: 40 * 40mm | |
| Lebelo la FOV: 0.45s/FOV | |
| Mochini oa lebelo o phahameng oa SMT SM471 | PCB boholo: MAX:460*250mm MIN:50*40mm T:0.38~4.2mm |
| Palo ea li-shafts tse ntseng li eketseha: 10 spindles x 2 cantilevers | |
| Boholo ba motsoako: Chip 0402(01005 inch) ~ □14mm(H12mm) IC,Sehokelo(lead pitch 0.4mm),※BGA,CSP(Tin ball spacing 0.4mm) | |
| Ho phahamisa ho nepahala: chip ± 50um@3ó/chip, QFP ± 30um@3ó/chip | |
| Lebelo la ho phahamisa: 75000 CPH | |
| Mochini oa lebelo o phahameng oa SMT SM482 | PCB boholo: MAX:460*400mm MIN:50*40mm T:0.38~4.2mm |
| Palo ea li-shafts tse ntseng li eketseha: 10 spindles x 1 cantilever | |
| Boholo ba karolo: 0402(01005 inch) ~ □16mm IC,Sehokelo(lead pitch 0.4mm),※BGA,CSP(Tin ball spacing 0.4mm) | |
| Ho nepahala ha ho hlongoa: ±50μm@μ+3σ (ho ea ka boholo ba chip e tloaelehileng) | |
| Lebelo la ho phahamisa: 28000 CPH | |
| HELLER MARK III Sebopi sa naetrojene reflux | Sebaka: libaka tse 9 tsa ho futhumatsa, libaka tse 2 tse pholileng |
| Mohloli oa mocheso: Ho tsamaisa moea o chesang | |
| Ho nepahala ha taolo ea mocheso: ± 1℃ | |
| Matla a matšeliso a mocheso: ±2℃ | |
| Lebelo la Orbital: 180-1800mm / min | |
| Bophara ba pina: 50—460mm | |
| AOI ALD-7727D | Molao-motheo oa ho lekanya: Khamera ea HD e fumana boemo bo bonahatsang karolo ka 'ngoe ea khanya ea mebala e meraro e khantšang holim'a boto ea PCB, 'me e e ahlole ka ho bapisa setšoantšo kapa ts'ebetso e utloahalang ea boleng bo bohlooho le ba RGB ba ntlha e' ngoe le e 'ngoe ea pixel. |
| Ntho ea tekanyo: Mefokolo ea khatiso ea solder, likaroloana, liphoso tse kopantsoeng tsa solder | |
| Qeto ea lense: 10um | |
| Ho nepahala: Qeto ea XY: ≤8um | |
| Tlhaloso: 3D X-RAY AX8200MAX | Boholo ba boholo ba ho lemoha: 235mm * 385mm |
| Matla a phahameng: 8W | |
| Boholo ba matla: 90KV/100KV | |
| Boholo ba maikutlo: 5μm | |
| Polokeho (lethal dose la mahlaseli): ＜1uSv/h | |
| Wave soldering DS-250 | PCB bophara: 50-250mm |
| PCB phetiso bophahamo: 750 ± 20 limilimithara | |
| Lebelo la phetisetso: 0-2000mm | |
| Bolelele ba sebaka sa preheating: 0.8M | |
| Palo ea sebaka sa preheating: 2 | |
| Nomoro ea wave: Dual wave | |
| Mochini o arolang boto | Sebaka sa ho sebetsa: MAX: 285 * 340mm MIN: 50 * 50mm |
| Ho itšeha ka nepo: ± 0.10mm | |
| Lebelo la ho itšeha: 0 ~ 100mm/S | |
| Lebelo la ho potoloha ha spindle: MAX: 40000rpm | |
| Bokhoni ba Theknoloji | ||
| Nomoro | Ntho | Bokhoni bo boholo |
| 1 | thepa ea motheo | Tg e Tlwaelehileng FR4, High Tg FR4, PTFE, Rogers, Low Dk/Df jj. |
| 2 | 'Mala oa mask oa solder | botala, bofubedu, boputswa, bosweu, bosehla, bopherese, botsho |
| 3 | 'Mala oa tšōmo | e tšoeu, e mosehla, e ntšo, e khubelu |
| 4 | Mofuta oa phekolo ea holim'a metsi | ENIG, Immersion tin, HAF, HAF LF, OSP, khauta e khanyang, monoana oa khauta, silevera e ntle |
| 5 | Max.kaho(L) | 50 |
| 6 | Max.boholo ba yuniti (mm) | 620*813 (24"*32") |
| 7 | Max.boholo ba phanele e sebetsang (mm) | 620*900 (24"x35.4") |
| 8 | Max.botenya ba boto (mm) | 12 |
| 9 | Min.botenya ba boto(mm) | 0.3 |
| 10 | Botenya ba boto (mm) | T<1.0 limilimithara: +/-0.10mm ;T≥1.00mm: +/-10% |
| 11 | Mamello ea ngoliso (mm) | +/-0.10 |
| 12 | Min.bophara ba lesoba la ho cheka ka mochini (mm) | 0.15 |
| 13 | Min.bophara ba lesoba la laser(mm) | 0.075 |
| 14 | Max.karolo (ka lesoba) | 15:1 |
| Max.karolo (micro-via) | 1.3:1 | |
| 15 | Min.moeli oa lesoba ho sebaka sa koporo(mm) | L≤10, 0.15;L=12-22,0.175;L=24-34, 0.2;L=36-44, 0.25;L＞44, 0.3 |
| 16 | Min.tumello ea kahare(mm) | 0.15 |
| 17 | Min.Molomo oa lesoba ho isa moeling oa lesoba(mm) | 0.28 |
| 18 | Min.Lekhalo la lesoba sebakeng sa mohala oa profil(mm) | 0.2 |
| 19 | Min.koporo ea kahare ho ea ho profil line sapce (mm) | 0.2 |
| 20 | Mamello ea ngoliso lipakeng tsa masoba (mm) | ±0.05 |
| 21 | Max.botenya ba koporo bo felileng | Lera le ka ntle: 420 (12oz) Lera ka Hare: 210 (6oz) |
| 22 | Min.trace wide (mm) | 0.075 (3mil) |
| 23 | Min.sebaka sa ho latela (mm) | 0.075 (3mil) |
| 24 | Botenya ba mask a solder (um) | huku ea mohala: >8 (0.3mil) holim'a koporo: >10 (0.4mil) |
| 25 | ENIG botenya ba khauta (um) | 0.025-0.125 |
| 26 | ENIG botenya ba nickle (um) | 3-9 |
| 27 | Botenya ba silevera ea Sterling (um) | 0.15-0,75 |
| 28 | Min.HAL botenya ba thini (um) | 0.75 |
| 29 | Botenya ba tin (um) | 0.8-1.2 |
| 30 | Botenya ba khauta bo botenya bo botenya ba khauta (um) | 1.27-2.0 |
| 31 | botenya ba khauta ea monoana oa khauta (um) | 0.025-1.51 |
| 32 | botenya ba nickle botenya ba monoana oa khauta oa khauta | 3-15 |
| 33 | botenya ba khauta e phatsimang (um) | 0,025-0.05 |
| 34 | botenya ba nickle ea khauta e phatsimang (um) | 3-15 |
| 35 | mamello ea boholo ba profaele (mm) | ±0.08 |
| 36 | Max.solder mask plugging lesoba size (mm) | 0.7 |
| 37 | BGA pad (mm) | ≥0.25 (HAL kapa HAL Mahala:0.35) |
| 38 | Mamello ea boemo ba V-CUT (mm) | +/-0.10 |
| 39 | Mamello ea boemo ba V-CUT (mm) | +/-0.10 |
| 40 | Tolerance angle ea khauta ea monoana (o) | +/-5 |
| 41 | Boikutlo ba ho impedence (%) | +/-5% |
| 42 | Mamello ea li-warpage (%) | 0.75% |
| 43 | Min.bophara ba tšōmo (mm) | 0.1 |
| 44 | Lelakabe la mollo le kokobela | 94V-0 |
| E khethehileng bakeng sa lihlahisoa tsa Via ka pad | Resin e kentsoeng ka boholo ba lesoba (min.) (mm) | 0.3 |
| Boholo ba lesoba le kentsoeng resin (boholo bo boholo) (mm) | 0.75 | |
| Botenya ba boto e kentsoeng ka resin (min.) (mm) | 0.5 | |
| Botenya ba boto e kentsoeng ka resin (max.) (mm) | 3.5 | |
| Resin e kenyellelitsoeng boholo ba likarolo tse kholo | 8:1 | |
| Resin e hoketsoe lesoba le bonyane sebakeng sa lesoba (mm) | 0.4 | |
| Na ho ka fapana boholo ba lesoba botong e le 'ngoe? | ho joalo | |
| Boto ea sefofane e ka morao | Ntho | |
| Max.boholo ba pnl (e felile) (mm) | 580*880 | |
| Max.boholo ba phanele e sebetsang (mm) | 914 × 620 | |
| Max.botenya ba boto (mm) | 12 | |
| Max.kaho(L) | 60 | |
| Karolo | 30:1 (Mosoba o Min.: 0.4 mm) | |
| Bophara ba mola/sebaka (mm) | 0.075/ 0.075 | |
| Bokhoni ba ho cheka ka morao | Ee | |
| Mamello ea ho cheka mokokotlo (mm) | ±0.05 | |
| Mamello ea masoba a tobetsang (mm) | ±0.05 | |
| Mofuta oa phekolo ea holim'a metsi | OSP, silevera e ntle, ENIG | |
| Boto e thata-flex | Boholo ba lesoba (mm) | 0.2 |
| Botenya ba dielectrical (mm) | 0.025 | |
| Boholo ba Panel e sebetsang (mm) | 350 x 500 | |
| Bophara ba mola/sebaka (mm) | 0.075/ 0.075 | |
| Stiffener | Ee | |
| Flex board layers (L) | 8 (4plys of flex board) | |
| Mekhahlelo e thata ea boto (L) | ≥14 | |
| Phekolo ea bokaholimo | Tsohle | |
| Flex board e bohareng kapa ka ntle | Ka bobeli | |
| E khethehileng bakeng sa lihlahisoa tsa HDI | Boholo ba lesoba la ho cheka ka laser (mm) | 0.075 |
| Max.botenya ba dielectric (mm) | 0.15 | |
| Min.botenya ba dielectric (mm) | 0.05 | |
| Max.karolo | 1.5:1 | |
| Boholo ba Pad e tlase (tlasa micro-via) (mm) | Boholo ba lesoba +0,15 | |
| Saese e ka hodimo ya Pedi (ho micro-via) (mm) | Boholo ba lesoba +0,15 | |
| Ho tlatsa koporo kapa che (ee kapa che) (mm) | ho joalo | |
| Ka moralo oa Pad kapa che (e kapa che) | ho joalo | |
| Resin e patiloeng e kentsoeng (e kapa che) | ho joalo | |
| Min.ka boholo bo ka tlatsoa ka koporo (mm) | 0.1 | |
| Max.linako tsa stack | lera lefe kapa lefe | |