Izixazululo ze-EMS zeBhodi Lesifunda Eliphrintiwe
Incazelo
Ifakwe i-SPI, i-AOI, kanye nedivayisi ye-X-ray yemigqa engu-20 ye-SMT, 8 DIP, nemigqa yokuhlola, sinikeza isevisi ethuthukisiwe ehlanganisa amasu amaningi okuhlanganisa futhi sikhiqize i-PCBA enezendlalelo eziningi, i-PCBA eguquguqukayo.Ilabhorethri yethu yobungcweti ine-ROHS, eyehlayo, i-ESD, namadivayisi okuhlola izinga lokushisa eliphezulu neliphansi.Yonke imikhiqizo idluliswa ngokulawulwa kwekhwalithi okuqinile.Sisebenzisa uhlelo oluthuthukisiwe lwe-MES lokuphathwa kokukhiqiza ngaphansi kwezinga le-IAF 16949, siphatha ukukhiqiza ngempumelelo nangokuphepha.
Ngokuhlanganisa izinsiza kanye nonjiniyela, singaphinda sinikeze izixazululo zohlelo, kusukela ekuthuthukisweni kohlelo lwe-IC kanye nesofthiwe kuya ekwakhiweni kwesekethe kagesi.Ngesipiliyoni sokuthuthukisa amaphrojekthi kwezokunakekelwa kwezempilo kanye ne-electronics yamakhasimende, singathatha imibono yakho futhi senze umkhiqizo wangempela uphile.Ngokuthuthukisa isofthiwe, uhlelo, kanye nebhodi ngokwalo, singaphatha yonke inqubo yokukhiqiza yebhodi, kanye nemikhiqizo yokugcina.Ngenxa yefekthri yethu ye-PCB kanye nonjiniyela, isinikeza izinzuzo zokuncintisana uma kuqhathaniswa nemboni evamile.Ngokusekelwe ekuklanyweni komkhiqizo nethimba lokuthuthukisa, indlela yokukhiqiza emisiwe yamanani ahlukene, nokuxhumana okuphumelelayo phakathi kochungechunge lokuhlinzeka, siyaqiniseka ukuthi sizobhekana nezinselele futhi senze umsebenzi wenziwe.
| PCBA Amandla | |
| Imishini ezenzakalelayo | Incazelo |
| Umshini wokumaka we-laser PCB500 | Ibanga lokumaka: 400 * 400mm |
| Isivinini: ≤7000mm/S | |
| Amandla aphezulu: 120W | |
| Ukushintsha i-Q, Isilinganiso somsebenzi: 0-25KHZ;0-60% | |
| Umshini wokunyathelisa i-DSP-1008 | Usayizi we-PCB: MAX:400*34mm MIN:50*50mm T:0.2~6.0mm |
| Usayizi westencil: MAX: 737 * 737mm MIN:420*520mm | |
| Ingcindezi ye-Scraper: 0.5 ~ 10Kgf/cm2 | |
| Indlela yokuhlanza: Ukuhlanza okomile, ukuhlanza okumanzi, ukuhlanza i-vacuum (kuyahleleka) | |
| Isivinini sokuphrinta: 6 ~ 200mm/sec | |
| Ukunemba kokuphrinta: ±0.025mm | |
| I-SPI | Umgomo wokulinganisa: 3D White Light PSLM PMP |
| Into yokulinganisa: Ivolumu yokunamathisela ye-Solder, indawo, ukuphakama, i-XY offset, umumo | |
| Ukulungiswa kwelensi: 18um | |
| Ukunemba: ukulungiswa kwe-XY: 1um; Isivinini esiphezulu: 0.37um | |
| Buka ubukhulu: 40*40mm | |
| Isivinini se-FOV: 0.45s/FOV | |
| Isivinini esiphezulu se-SMT umshini SM471 | Usayizi we-PCB: MAX:460*250mm MIN:50*40mm T:0.38~4.2mm |
| Inani lamashafu afakwayo: 10 ama-spindle x 2 cantilever | |
| Usayizi wengxenye: I-Chip 0402(01005 intshi) ~ □14mm(H12mm) IC,Isixhumi(iphimbo lokuhola 0.4mm),※BGA,CSP(Isikhala sebhola likathini 0.4mm) | |
| Ukunemba kokukhweza: chip ±50um@3ó/chip, QFP ±30um@3ó/chip | |
| Isivinini sokukhweza: 75000 CPH | |
| Isivinini esiphezulu se-SMT umshini SM482 | Usayizi we-PCB: UMAX:460*400mm MIN:50*40mm T:0.38~4.2mm |
| Inani lamashafti afakwayo: 10 ama-spindles x 1 cantilever | |
| Usayizi wengxenye: 0402(01005 iyintshi) ~ □16mm IC,Isixhumi(i-lead pitch 0.4mm),※BGA,CSP(Isikhala sebhola likathini 0.4mm) | |
| Ukunemba kokukhweza: ±50μm@μ+3σ (ngokuya ngosayizi we-chip ojwayelekile) | |
| Isivinini sokukhweza: 28000 CPH | |
| U-HELLER MARK III Isithando somlilo se-nitrogen reflux | Indawo: 9 izindawo zokushisa, izindawo zokupholisa ezi-2 |
| Umthombo wokushisa: Iconvection yomoya oshisayo | |
| Ukunemba kokulawula izinga lokushisa: ±1℃ | |
| Umthamo wesinxephezelo esishisayo: ±2℃ | |
| Isivinini se-Orbital: 180—1800mm/min | |
| Ibanga lobubanzi bethrekhi: 50—460mm | |
| I-AOI ALD-7727D | Umgomo wokulinganisa: Ikhamera ye-HD ithola isimo sokuboniswa kwengxenye ngayinye yokukhanya okunemibala emithathu ekhipha imisebe ebhodini le-PCB, futhi iyahlulela ngokufanisa isithombe noma ukusebenza okunengqondo kwamanani ampunga nawe-RGB wephoyinti ngalinye lephikseli. |
| Into yokulinganisa: Ukukhubazeka kokuphrinta kwe-Solder, izingxenye ezingalungile, ukukhubazeka okuhlangene kwe-solder | |
| Ukulungiswa kwelensi: 10um | |
| Ukunemba: ukulungiswa kwe-XY: ≤8um | |
| I-3D X-RAY AX8200MAX | Ubukhulu bosayizi wokutholwa: 235mm*385mm |
| Amandla aphezulu: 8W | |
| Amandla kagesi aphezulu: 90KV/100KV | |
| Usayizi wokugxila: 5μm | |
| Ukuphepha (umthamo womsebe): ＜1uSv/h | |
| I-Wave soldering DS-250 | Ububanzi be-PCB: 50-250mm |
| Ubude bokudluliselwa kwe-PCB: 750 ± 20 mm | |
| Isivinini sokudlulisa: 0-2000mm | |
| Ubude bendawo yokushisa ngaphambili: 0.8M | |
| Inombolo yendawo yokushisisa kwangaphambili: 2 | |
| Inombolo yegagasi: Igagasi elikabili | |
| Umshini wokuhlukanisa ibhodi | Ibanga lokusebenza: MAX:285*340mm MIN:50*50mm |
| Ukusika ukunemba: ± 0.10mm | |
| Isivinini sokusika: 0 ~ 100mm/S | |
| Isivinini sokujikeleza kwe-spindle: MAX: 40000rpm | |
| Ikhono Lobuchwepheshe | ||
| Inombolo | Into | Amandla amakhulu |
| 1 | impahla eyisisekelo | I-Tg FR4 evamile, i-High Tg FR4, i-PTFE, i-Rogers, i-Dk/Df ephansi njll. |
| 2 | Umbala wemaski we-Solder | oluhlaza, obomvu, oluhlaza okwesibhakabhaka, omhlophe, ophuzi, onsomi, omnyama |
| 3 | Umbala welejendi | omhlophe, ophuzi, omnyama, obomvu |
| 4 | Uhlobo lokwelapha olungaphezulu | I-ENIG, I-Immersion tin, HAF, HAF LF, OSP, igolide elikhanyayo, umunwe wegolide, isiliva esicwebezelayo |
| 5 | Ubukhulu.ungqimba (L) | 50 |
| 6 | Ubukhulu.usayizi weyunithi (mm) | 620*813 (24"*32") |
| 7 | Ubukhulu.usayizi wephaneli yokusebenza (mm) | 620*900 (24"x35.4") |
| 8 | Ubukhulu.ubukhulu bebhodi (mm) | 12 |
| 9 | Okuncane.ubukhulu bebhodi(mm) | 0.3 |
| 10 | Ukubekezelela ubukhulu bebhodi (mm) | T<1.0 mm: +/-0.10mm ;T≥1.00mm: +/-10% |
| 11 | Ukubekezelela ukubhalisa (mm) | +/-0.10 |
| 12 | Okuncane.Ububanzi bembobo yokumba ngomshini (mm) | 0.15 |
| 13 | Okuncane.I-laser drilling hole ububanzi(mm) | 0.075 |
| 14 | Ubukhulu.isici (ngembobo) | 15:1 |
| Ubukhulu.isici (micro-via) | 1.3:1 | |
| 15 | Okuncane.unqenqema lwembobo endaweni yethusi(mm) | L≤10, 0.15;L=12-22,0.175;L=24-34, 0.2;L=36-44, 0.25;L＞44, 0.3 |
| 16 | Okuncane.imvume ye-innerlay(mm) | 0.15 |
| 17 | Okuncane.unqenqema lwembobo ukuya endaweni enqenqemeni yembobo(mm) | 0.28 |
| 18 | Okuncane.unqenqema lwembobo endaweni yomugqa wephrofayela(mm) | 0.2 |
| 19 | Okuncane.ithusi le-innerlay kumugqa wephrofayili (mm) | 0.2 |
| 20 | Ukubekezelela ukubhalisa phakathi kwezimbobo (mm) | ±0.05 |
| 21 | Ubukhulu.ugqinsi lwethusi oluqediwe (um) | Isendlalelo Sangaphandle: 420 (12oz) Isendlalelo sangaphakathi: 210 (6oz) |
| 22 | Okuncane.trace ububanzi (mm) | 0.075 (3mil) |
| 23 | Okuncane.indawo yokulandelela (mm) | 0.075 (3mil) |
| 24 | Ubukhulu bemaski ye-solder (um) | Ikhona lomugqa: >8 (0.3mil) phezu kwethusi: >10 (0.4mil) |
| 25 | Ugqinsi lwegolide lwe-ENIG (um) | 0.025-0.125 |
| 26 | Ubukhulu be-nickle ye-ENIG (um) | 3-9 |
| 27 | Ugqinsi lwesiliva lwe-Sterling (um) | 0.15-0,75 |
| 28 | Okuncane.I-HAL tin ukujiya (um) | 0.75 |
| 29 | Ubukhulu bethini lokucwiliswa (um) | 0.8-1.2 |
| 30 | Ugqinsi lwegolide olugqize ngegolide (um) | 1.27-2.0 |
| 31 | ugqinsi lwegolide lomunwe wegolide (um) | 0.025-1.51 |
| 32 | ugqinsi lwe-nickle lomunwe wegolide (um) | 3-15 |
| 33 | ugqinsi lwegolide olucwebezelayo (um) | 0,025-0.05 |
| 34 | ugqinsi lwe-nickle yegolide ecwebezelayo (um) | 3-15 |
| 35 | ukubekezelela usayizi wephrofayela (mm) | ±0.08 |
| 36 | Ubukhulu.imaski yokuxhuma usayizi wembobo (mm) | 0.7 |
| 37 | Iphedi ye-BGA (mm) | ≥0.25 (HAL noma i-HAL Mahhala:0.35) |
| 38 | Ukubekezelela indawo ye-V-CUT blade (mm) | +/-0.10 |
| 39 | Ukubekezelela isikhundla se-V-CUT (mm) | +/-0.10 |
| 40 | Ukubekezelela i-engeli ye-golden bevel (o) | +/-5 |
| 41 | Ukubekezelela impedence (%) | +/-5% |
| 42 | Ukubekezelela i-Warpage (%) | 0.75% |
| 43 | Okuncane.ububanzi be-legend (mm) | 0.1 |
| 44 | Ilangabi lomlilo liyaphola | 94V-0 |
| Okukhethekile kwe-Via emikhiqizweni yephedi | Usayizi wembobo exhunyiwe ye-resin (min.) (mm) | 0.3 |
| Usayizi wembobo exhunyiwe ye-resin (ubukhulu) (mm) | 0.75 | |
| Ukujiya kwebhodi elixhunyiwe nge-resin (min.) (mm) | 0.5 | |
| Ubukhulu bebhodi elixhunyiwe nge-resin (ubukhulu) (mm) | 3.5 | |
| I-resin exhunyiwe ye-aspect ratio ephezulu | 8:1 | |
| I-resin ixhume imbobo encane esikhaleni sembobo (mm) | 0.4 | |
| Ingabe ungahlukanisa usayizi wembobo ebhodini elilodwa? | yebo | |
| Ibhodi lendiza elingemuva | Into | |
| Ubukhulu.usayizi we-pnl (uqediwe) (mm) | 580*880 | |
| Ubukhulu.usayizi wephaneli yokusebenza (mm) | 914 × 620 | |
| Ubukhulu.ubukhulu bebhodi (mm) | 12 | |
| Ubukhulu.ungqimba (L) | 60 | |
| Isici | 30:1 (Imbobo encane: 0.4 mm) | |
| Ububanzi bomugqa/isikhala (mm) | 0.075/ 0.075 | |
| Ikhono lokubhola emuva | Yebo | |
| Ukubekezelela ukubhola emuva (mm) | ±0.05 | |
| Ukubekezelela izimbobo zokucindezela (mm) | ±0.05 | |
| Uhlobo lokwelapha olungaphezulu | I-OSP, isiliva esicwebezelayo, i-ENIG | |
| Ibhodi le-Rigid-flex | Usayizi wembobo (mm) | 0.2 |
| Ubukhulu be-Dielectrical (mm) | 0.025 | |
| Usayizi Wephaneli Esebenzayo (mm) | 350 x 500 | |
| Ububanzi bomugqa/isikhala (mm) | 0.075/ 0.075 | |
| I-Stiffener | Yebo | |
| Izendlalelo zebhodi le-Flex (L) | 8 (amapuleti ama-4 ebhodi eliguqukayo) | |
| Izendlalelo zebhodi eziqinile (L) | ≥14 | |
| Ukwelashwa kwendawo | Konke | |
| Ibhodi le-Flex phakathi noma ungqimba lwangaphandle | Kokubili | |
| Okukhethekile kwemikhiqizo ye-HDI | Usayizi wembobo yokumba i-laser (mm) | 0.075 |
| Ubukhulu.ubukhulu be-dielectric (mm) | 0.15 | |
| Okuncane.ubukhulu be-dielectric (mm) | 0.05 | |
| Ubukhulu.isici | 1.5:1 | |
| Usayizi Wephedi Eliphansi (ngaphansi kwe-micro-via) (mm) | Usayizi wembobo+0.15 | |
| Usayizi wephedi ohlangothini olungaphezulu ( ku-micro-via) (mm) | Usayizi wembobo+0.15 | |
| Ukugcwaliswa kwethusi noma cha (yebo noma cha) (mm) | yebo | |
| Nge-Pad design noma cha (yebo noma cha) | yebo | |
| I-resin yembobo engcwatshiwe ixhunyiwe (yebo noma cha) | yebo | |
| Okuncane.ngosayizi ingagcwaliswa ithusi (mm) | 0.1 | |
| Ubukhulu.izikhathi zesitaki | noma yisiphi isendlalelo | |